MicroCube is the latest generation of thermal cores in 12μm pixel pitch feature true SWaP design and cover main standard interfaces, including USB-C or MIPI CSI-2. Size, weight and power altogether make this European-made thermal core the ideal candidate for all applications where consumption and/or footprint are key factors, namely UAVs, UGVs and robot-type platforms, as well as handheld devices and all battery-powered equipment.
Technical Information
| Key performances | |
|---|---|
| Sensor | Micro-bolometer technology |
| Resolution / Pixel pitch | 640 x 480 pixels |
| Spectral response | LWIR: 8 – 14 μm |
| Pixel size | 12 μm |
| Max NETD (F/1; 300 mK; 30 fps) | < 40 mK |
| Frame rate | Up to 60 fps |
| For module (host-based processing) | USB-C |
| For core engine (embedded processing) | BT 656 / YCbCr / MONO16 / MIPI CSI-2 |
| Dimension | 22 x 22 mm2 (section) / from 22 (depth) |
| Weight | From 22 g |
| Optics | From 4.3 mm to 100+ mm EFL |
| Qualifications | MIL-STD 810G and MIL-STD-883 (TWS) |
Description
MicroCube640 serie offers high sensitivity in 22 mm cube side, weighing 22 g and consuming 0.82 W, will open the door of numerous applications. The MicroCube VGA (640x480 pixels) format takes benefits of existing Photonis technology, with key functionalities such as shutterless, automated gain control (AGC) and trigger.
This new state-of-the-art camera core enables OEMs to easily and quickly build their thermal systems with improved Detection, Recognition and Identification (DRI) features. Wide range of interfaces have also been taken-into account to cover the main standards that include the standard MIPI CSI-2.
Features
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640 x 480 micro-bolometer with 12 μm pixels
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Compact and feather-weighted
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Easy to integrate
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Low-power consumption
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Typical NETD 35mK (F/1; 300 mK; 30 fps)
Documentation
Brochure/Leaflet
MicroCube640 / 640E(969.11 KB)
